Kev vam meej ntawm ceramic board

Nrog rau kev nce qib ntawm kev siv tshuab hluav taws xob tas mus li, qhov teeb meem ntawm cov cua sov dissipation tau maj mam dhau los ua lub fwj txwv txoj kev loj hlob ntawm cov khoom siv hluav taws xob siab thiab lub teeb yuag. Kev sib txuas ntxiv ntawm cov cua sov hauv cov khoom hluav taws xob hluav taws xob ua rau cov nti hlws ris kub maj mam nce, thiab ua kom muaj kev ntxhov siab thermal, uas ua rau muaj teeb meem kev ntseeg siab xws li txo lub neej thiab xim kub hloov. Nyob rau hauv daim ntawv thov ntim cov khoom siv hluav taws xob hluav taws xob, lub tshav kub dissipation substrate tsis tsuas yog dais lub luag haujlwm ntawm kev sib txuas hluav taws xob thiab kev txhawb nqa txhua yam, tab sis kuj yog ib qho tseem ceeb hauv kev xa hluav taws xob. Rau cov khoom siv hluav taws xob hluav taws xob, cov khoom ntim hauv qab yuav tsum muaj cov thermal conductivity siab, rwb thaiv tsev thiab kub tsis kam, nrog rau siab thermal expansion coefficient txuam nrog lub zog nti. Tam sim no, hlau core board (MCPCB) thiab ceramic board yog lub ntsiab tshav kub dissipation substrates ntawm lub khw. Vim tias qhov tsis tshua muaj thermal conductivity ntawm thermal rwb thaiv tsev txheej, MCPCB tau dhau los ua nyuaj rau kev hloov mus rau kev tsim kho cov khoom siv hluav taws xob hluav taws xob. Raws li cov khoom siv hluav taws xob tshiab, ceramic substrate muaj qhov sib piv tsis tau zoo xws li thermal conductivity thiab rwb thaiv tsev, thiab qhov chaw metallization ntawm ceramic substrate yog ib qho tseem ceeb ua ntej rau nws daim ntawv thov.