Yog vim li cas thiab kev daws teeb meem rau PCB Blasting

PCB blasting yog hais txog blistering ntawm tooj liab ntawv ci, blistering ntawm lub rooj tsavxwm, delamination los yog dip vuam, yoj soldering, reflow soldering, thiab lwm yam. ntawm tiav lawm PCB vim thermal los yog mechanical txiav txim thaum lub sij hawm PCB ua, uas yog hais txog qhov tshwm sim ntawm Thermal shock. Copper foil blistering, Circuit Court txiav, board blistering, txheej, thiab lwm yam. ua explosive npoo.

Luam tawm Circuit Board blasting yog qhov teeb meem tseem ceeb uas cuam tshuam rau kev ntseeg siab ntawm lub rooj tsavxwm, thiab nws cov laj thawj yog qhov nyuaj thiab ntau yam. Lub ntsiab yog vim li cas rau blistering yog cov txheej txheem tsim cov teeb meem xws li tsis txaus tshav kub tsis kam ntawm lub rooj tsavxwm, siab ua hauj lwm kub, thiab ntev cua sov lub sij hawm. Cov laj thawj yog:

1. Yog tias lub rooj tsavxwm tsis kho tag nrho, lub thermal kuj ntawm lub rooj tsavxwm yuav poob. Yog tias PCB ua tiav lossis raug thermal shock, tooj liab clad laminate yog ib qho yooj yim rau blister. Yog vim li cas rau kev kho tsis txaus ntawm lub rooj tsavxwm tuaj yeem yog vim qhov ntsuas kub tsis tshua muaj hluav taws xob thaum lub sij hawm sib txuas, lub sij hawm rwb thaiv tsev tsis txaus, thiab tsis txaus tus neeg sawv cev kho.

Rau ntau txheej PCB presses, tom qab tshem tawm cov prepreg los ntawm lub txias substrate, nws yuav tsum tau khaws cia nyob rau hauv ib tug kub ntawm 24 teev nyob rau hauv lub saum toj no cua txias ib puag ncig ua ntej txiav thiab laminating lub prepreg mus rau lub puab board. Tom qab lamination tiav lawm, nws yuav tsum raug xa mus rau cov xovxwm rau lamination tsis pub dhau ib teev. Qhov no yog los tiv thaiv kev nqus dej ntawm prepreg, ua rau cov fab dawb, npuas, delamination, thermal shock, thiab lwm yam tshwm sim hauv cov khoom laminated. Tom qab stacking thiab pub rau hauv xovxwm, cua tuaj yeem tso tawm ua ntej, thiab tom qab ntawd cov xovxwm tuaj yeem raug kaw. Qhov no zoo heev pab txo qhov cuam tshuam ntawm noo noo ntawm cov khoom.

2.Yog tias lub rooj tsavxwm tsis muaj kev tiv thaiv zoo thaum lub sijhawm khaws cia, nws yuav nqus dej noo. Yog tias nws raug tso tawm thaum lub sijhawm tsim cov txheej txheem PCB, lub rooj tsavxwm yuav ua rau tawg. Cov chaw tsim khoom yuav tsum rov ntim cov khoom siv tooj liab tsis siv tom qab qhib kom txo tau cov dej noo ntawm cov ntawv luam tawm.

3.Thaum siv tooj liab clad boards nrog qis TG los tsim cov ntawv luam tawm Circuit Court boards uas yuav tsum tau muaj cua sov siab dua, cov cua kub tsis kam ntawm lub rooj tsavxwm tuaj yeem ua rau muaj teeb meem ntawm substrate blasting. Kev kho tsis txaus ntawm lub rooj tsavxwm tuaj yeem txo nws cov TG, uas tuaj yeem ua rau lub rooj tsavxwm tawg yooj yim lossis tig daj daj thaum lub sijhawm tsim khoom PCB.

Hauv kev tsim khoom thaum ntxov ntawm FR-4 cov khoom, tsuas yog Tg135 degree epoxy resin tau siv. Yog tias cov txheej txheem tsim khoom tsis tsim nyog, TG ntawm lub substrate feem ntau nyob ib ncig ntawm 130 degree. Txhawm rau ua kom tau raws li cov neeg siv khoom PCB, Tg ntawm universal epoxy resin tuaj yeem ncav cuag 140 degree. Yog tias muaj teeb meem nrog cov txheej txheem PCB lossis yog lub rooj tsavxwm tig daj daj, cov ntsiab lus siab Tg epoxy resin tuaj yeem txiav txim siab.

Cov xwm txheej saum toj no muaj nyob hauv cov khoom sib xyaw CEM-1. Piv txwv li, cov txheej txheem PCB ntawm CEM-1 cov khoom yuav muaj kev tawg, thiab lub rooj tsavxwm tuaj yeem tshwm daj daj. Qhov xwm txheej no tsis yog tsuas yog cuam tshuam txog kev tiv thaiv tshav kub ntawm FR-4 daim ntawv nplaum rau ntawm qhov chaw ntawm CEM-1 cov khoom, tab sis kuj rau qhov kub tsis kam ntawm cov resin composite ntawm cov ntaub ntawv tseem ceeb.

4. Yog tias tus number case luam tawm ntawm cov khoom cim yog tuab thiab muab tso rau ntawm qhov chaw sib cuag nrog cov ntawv ci tooj liab, tus number case yog incompatible nrog cov resin, uas txo cov adhesion ntawm cov ntawv ci tooj liab thiab ua rau cov substrate yuav deterioration, uas tej zaum yuav ua rau blasting.