Daim ntawv thov HDI

Thaum tsim hluav taws xob tas li txhim kho kev ua tau zoo ntawm tag nrho lub tshuab, nws kuj tseem sim txo nws qhov loj. Hauv cov khoom lag luam me me los ntawm cov xov tooj ntawm tes mus rau cov riam phom ntse, "me" yog kev nrhiav mus ib txhis. High Density Integration (HDI) thev naus laus zis ua rau ntau qhov me me ntawm cov khoom tsim khoom kawg thaum ua tau raws cov qauv siab dua rau kev ua haujlwm hluav taws xob thiab kev ua haujlwm zoo. HDI tau dav siv hauv xov tooj ntawm tes, digital (lub koob yees duab) koob yees duab, MP3, MP4, laptop computers, automotive electronics thiab lwm yam khoom siv digital, ntawm cov xov tooj ntawm tes yog siv dav tshaj plaws. HDI boards feem ntau yog tsim los ntawm txoj kev tsim. Ordinary HDI boards yog ib qho kev tsim ib zaug, thiab high-end HDI siv ob los yog ntau tshaj cov thev naus laus zis, thaum siv cov thev naus laus zis PCB xws li stacking, electroplating, thiab laser direct drilling. High-end HDI boards yog siv nyob rau hauv 3G mobile xov tooj, advanced cov koob yees duab, IC carrier boards, thiab lwm yam.

Kev loj hlob zeem muag: Raws li kev siv high-end HDI boards - 3G boards lossis IC substrates, nws txoj kev loj hlob yav tom ntej yog sai heev: lub ntiaj teb 3G xov tooj ntawm tes kev loj hlob yuav ntau dua 30 feem pua ​​​​hauv ob peb xyoos tom ntej, thiab Tuam Tshoj yuav sai sai no tso cai 3G; IC substrate kev lag luam sab laj Institution Prismark kwv yees hais tias Tuam Tshoj txoj kev kwv yees kev loj hlob ntawm 2005 txog 2010 yog 80 feem pua, uas sawv cev rau kev txhim kho kev taw qhia ntawm PCB.